Panar magnetron

The MP.01-03 magnetron sputtering device is used as part of vacuum deposition installations and is intended for obtaining thin-film coatings for various purposes. The target cathode of the magnetron sputtering device is the source of the sputtered material. The MP.01-03 magnetron sputtering device is used for sputtering conductive non-magnetic materials. The magnetron sputtering device is an integral part of the magnetron sputtering system and is operated together with the power supply unit and the working gas supply system. The product can be used in laboratory and production premises at an ambient temperature of 5 °C to 40 °C, with a relative humidity of no more than 80%.

The MP.01-03 magnetron sputtering device was developed specifically for the modernization of existing BULAT-6 installations to convert them from the arc mode of operation to the magnetron one. Replacing standard arc sources of the coating material allows you to significantly lower the temperature of the processed substrates and this makes it possible to process parts with a low temperature of phase transitions. In addition, the droplet phase is completely absent in the material flow generated by the MP.01-03 magnetron sputtering device, which makes it possible to obtain higher-quality coatings without pores and with less surface roughness. In the manufacture of the MP.01-03 magnetron sputtering device, a large number of parts from the standard arc plasma source of the Bulat-6 installation are used, which significantly reduces the cost and speeds up the process of its modernization.

Device of magnetron sputtering MP.01-03

The surface of the part with a coating applied using the standard arc source of the Bulat-6 installation

The surface of the part with a coating applied using the MP.01-03 magnetron sputtering device

Technical characteristics of magnetron sputtering MP.01-03